A support substrate for wafer bonding with high thermal conductivity, close to the thermal expansion coefficient of semiconductor materials!
We handle "support substrates for wafer bonding." Starting with "pure Mo," which is suitable for power applications requiring high output and high reliability, we also offer "Cu-Mo," which is easy to roll and press, and "Cu-W," which combines the low thermal expansion of W with the high thermal conductivity of Cu. It boasts a thermal expansion coefficient close to that of semiconductor materials and high thermal conductivity. 【Features】 ■ For wafer bonding ■ High thermal conductivity ■ Close to the thermal expansion coefficient of semiconductor materials *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■Cu-W ■Cu-Mo ■Mo *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■ For wafer bonding *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Allied Material Co., Ltd. was established in 2000 through the merger of Tokyo Tungsten Co., Ltd. and Osaka Diamond Industrial Co., Ltd. Since then, we have steadily grown as a part of the Sumitomo Electric Group's industrial materials division, with the refining, material manufacturing, and processing technology of high melting point metal materials such as tungsten and molybdenum, as well as the manufacturing and precision processing technology of diamond precision tools as the two pillars of our business. We will continue to strive to create new added value based on our core technologies in order to survive alongside our customers in the rapidly changing market environment that is expected in the future, and we will continue to challenge ourselves to provide even higher satisfaction.