アライドマテリアル Product Lineup

"Ag-Diamond" is a composite material of silver and diamond. It has a higher thermal conductivity (600W/(m·K)) than "Cu-Diamond" and is applicable for large area applications of 50×50mm². In addition to being able to be plated with Ni or Ni/Au on the surface, it also supports high-temperature (800℃) silver brazing. 【Features】 ■ Stable high thermal conductivity of over 600W/(m·K) ■ Surface can be plated with Ni or Ni/Au ■ Supports high-temperature (800℃) silver brazing *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We handle "CPC Heat Sinks (Cu, Cu-Mo, Cu Composites)." They have high thermal conductivity that maximizes the performance of semiconductor devices and can be supplied in large quantities stably through rolling and punching processes. These products can be applied to wireless communication in mobile phone base stations. 【Features】 ■ High thermal conductivity that maximizes the performance of semiconductor devices ■ Stable supply in large quantities through rolling and punching processes ■ A lineup of materials with various thermal conductivities and thermal expansion rates *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We handle "support substrates for wafer bonding." Starting with "pure Mo," which is suitable for power applications requiring high output and high reliability, we also offer "Cu-Mo," which is easy to roll and press, and "Cu-W," which combines the low thermal expansion of W with the high thermal conductivity of Cu. It boasts a thermal expansion coefficient close to that of semiconductor materials and high thermal conductivity. 【Features】 ■ For wafer bonding ■ High thermal conductivity ■ Close to the thermal expansion coefficient of semiconductor materials *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We handle the heat dissipation substrate material "Cu-Diamond/Cu-W Submount." Sharp edge processing and AuSn deposition are possible. We offer a lineup of materials with various thermal expansion coefficients and thermal conductivities. "W-10T" has achieved a high thermal conductivity Cu-W submount while maintaining low thermal expansion equivalent to conventional materials through our unique immersion technology. 【Features】 ■ High thermal conductivity ■ Cu-Diamond submount > 500 W/(m·K) ■ High thermal conductivity Cu-W submount realized (W-10T) ■ Lineup of materials with various thermal expansion coefficients and thermal conductivities ■ Sharp edge processing and AuSn deposition are possible *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

The diamond wheel for substrate grinding "NanoMate Premium" improves productivity by hundreds of times compared to lapping processing for two-axis (rough and finishing) grinding. Continuous processing with #2000 (average particle size 9μm) rough grinding achieves a feed rate of 120μm/min. Continuous processing with #8000 (average particle size 0.5μm) finishing grinding realizes both low-load processing and low grinding wheel wear. 【Features】 ○ Excellent abrasive retention (bond with good wettability) ○ Excellent abrasive dispersion ○ No dressing required ○ Surface quality comparable to lapping processed surfaces ○ Improved device characteristics with ultra-thin wafers For more details, please contact us or download the catalog.

• Other cutting tools