High heat dissipation that maximizes the performance of semiconductor devices! Stable mass supply is possible through rolling and punching processes.
We handle "CPC Heat Sinks (Cu, Cu-Mo, Cu Composites)." They have high thermal conductivity that maximizes the performance of semiconductor devices and can be supplied in large quantities stably through rolling and punching processes. These products can be applied to wireless communication in mobile phone base stations. 【Features】 ■ High thermal conductivity that maximizes the performance of semiconductor devices ■ Stable supply in large quantities through rolling and punching processes ■ A lineup of materials with various thermal conductivities and thermal expansion rates *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Application Examples】 ■ Mobile Phone Base Stations (Wireless Communication) *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Allied Material Co., Ltd. was established in 2000 through the merger of Tokyo Tungsten Co., Ltd. and Osaka Diamond Industrial Co., Ltd. Since then, we have steadily grown as a part of the Sumitomo Electric Group's industrial materials division, with the refining, material manufacturing, and processing technology of high melting point metal materials such as tungsten and molybdenum, as well as the manufacturing and precision processing technology of diamond precision tools as the two pillars of our business. We will continue to strive to create new added value based on our core technologies in order to survive alongside our customers in the rapidly changing market environment that is expected in the future, and we will continue to challenge ourselves to provide even higher satisfaction.