It is a flexible substrate effective for high-density wiring. FPC
Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC
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basic information
Unlike conventional through holes, to avoid penetrating the hole, a via is installed directly beneath the pad. Fine hole processing using lasers is possible and is effective for ultra-high-density wiring. With the miniaturization and thinning of mobile devices and the enhancement of communication equipment, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Accordingly, high multilayering and high density are also progressing in flexible substrates. Flexible substrates, FPC, rigid-flex, high heat resistance, membrane switches, printed circuit boards, substrate design, pattern design, assembly, SMD assembly, substrate analysis, circuit design, software, hardware, electronic circuit design, rigid-flex, heat dissipation substrates, special substrates, stretchable substrates, transparent polyimide, polyimide, MEMS, semiconductors, special materials, plating technology, wearables.
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On-board devices, industrial equipment, medical devices, wearable terminals, amusement, semiconductors, home appliances and AV equipment, optical devices, audio and video equipment, office automation equipment, information and communication devices, machine tools, etc. FPC
Company information
Sartec is a manufacturing support company based in Hamamatsu City, Shizuoka Prefecture, focused on flexible circuit board design. Going beyond our core strength and origin in "flexible circuit board design," we provide support tailored to each stage of development, from initial development to mass production, including software/hardware development, enclosure design, prototype evaluation, and manufacturing support. Printed circuit boards are an essential component often referred to as the "heart" of a product. Because we have a deep understanding of this core part, we can create a development process with minimal setbacks through our approach of "manufacturing that considers the user's experience" combined with "process design capabilities that encompass the entire product," turning the ideals of researchers and developers into tangible reality. At Sartec, we have a wide range of achievements across various fields, from cutting-edge special designs in medical and aerospace sectors to everyday products like automobiles and IoT appliances. We are also flexibly responding to the semiconductor field, which has been gaining attention in recent years, expanding the possibilities of technology through processes like film formation. If you have a desire to challenge conventional industry norms and pursue products or new technologies that do not yet exist in the world, please feel free to consult with Sartec.
![[Design and Production Example] Coil_FPC for Motor Field Windings](https://image.mono.ipros.com/public/product/image/396/2000618456/IPROS87961089620937907596.png?w=280&h=280)
![[Case] Flexibility case for substrate + wire products](https://image.mono.ipros.com/public/product/image/226/2000618459/IPROS36706719506596335607.png?w=280&h=280)
