サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計

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サーテック Company Profile
As a "technology development partner," we provide consistent support from the conceptual stage of product development to mass production, starting with flexible circuit board design.
Sartec is a manufacturing support company based in Hamamatsu City, Shizuoka Prefecture, focused on flexible circuit board design. Going beyond our core strength and origin in "flexible circuit board design," we provide support tailored to each stage of development, from initial development to mass production, including software/hardware development, enclosure design, prototype evaluation, and manufacturing support. Printed circuit boards are an essential component often referred to as the "heart" of a product. Because we have a deep understanding of this core part, we can create a development process with minimal setbacks through our approach of "manufacturing that considers the user's experience" combined with "process design capabilities that encompass the entire product," turning the ideals of researchers and developers into tangible reality. At Sartec, we have a wide range of achievements across various fields, from cutting-edge special designs in medical and aerospace sectors to everyday products like automobiles and IoT appliances. We are also flexibly responding to the semiconductor field, which has been gaining attention in recent years, expanding the possibilities of technology through processes like film formation. If you have a desire to challenge conventional industry norms and pursue products or new technologies that do not yet exist in the world, please feel free to consult with Sartec.

Business Activities
■Development support in each phase (from comprehensive proposals to spot requests) 1. Product Planning: Element development contract services Support for product design, graphic design, 3D CG design, software, system applications, hardware development design, benchmark analysis, reverse engineering, etc. 2. Design: Circuit board design services Flexible circuit board and rigid circuit board design, etc. 3. Prototype Evaluation Testing: Testing & analysis contract services Reliability evaluation testing, destructive testing, non-destructive testing, benchmark analysis, analysis, simulation, analysis, failure cause investigation, repair work, etc. 4. Mass Production: Mass production contract services (EMS) Mass production startup both domestically and internationally, etc. ■Special design of flexible circuit boards New technology board manufacturing, special board manufacturing, special processing and assembly, etc. ■Thin film processing contract services Design of film formation specifications, optimization of process conditions, mass production management, etc. Software contract development, firmware/embedded, FPGA (PLD) contract development, flexible circuit boards, flex boards, FPC, flex, rigid-flex, hardware, thin film.
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Detailed information
Company name | サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計 |
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Contact address | postalcode 431-3125 Shizuoka/ Hamamatsu-shi Chuo-ku/ 5-11-21 HandayamaView on map TEL:053-522-9255 |
Key Partners | Flexible circuit board, flex board, FPC, flex, rigid-flex
High heat resistance, membrane switch, flexible circuit board, flex, FPC, printed circuit board
To development department managers and personnel considering the development and prototyping of
Software contract development, firmware/embedded, FPGA (PLD) contract development, flexible circuit board, flex board, FPC, flex, rigid-flex, hardware, thin film deposition
High heat resistance, membrane switch, flexible circuit board, flex, FPC, printed circuit board
For development and prototyping, resin, metal cutting
Software contract development, firmware/embedded, FPGA (PLD) contract development, core systems, production management systems, order management systems
Flexible circuit board, flex board, FPC, flex, rigid-flex
High heat resistance, membrane switch, flexible circuit board, flex, FPC, printed circuit board
For development and prototyping, resin, metal cutting
Software contract development, firmware/embedded, FPGA (PLD) contract development, core systems, production management systems, order management systems, hardware, etching, plating, MSAP, vacuum deposition, EB deposition, sputtering, thin film deposition, photolithography, Flexible circuit board, flex circuit, FPC, flex, rigid-flex, high heat resistance, membrane switch, flexible circuit board, flex, FPC, printed circuit board, software contract development, firmware/embedded, FPGA (PLD) contract development, core system, hardware, resin, metal cutting etching, MSAP, deposition, sputtering, thin film formation, photolithography. |
Industry | Electronic Components and Semiconductors |
