Maximize inspection efficiency! For those who want to achieve wide, detailed, and fast results.
CIS CoaXPress Camera Series / Camera Link Camera Series
A wide range of industrial cameras that are suitable for various needs such as labor-saving, reducing personnel, and increasing productivity, all capable of high resolution and high-speed capture!
With the diversification of product needs in the market, there is a demand for inspection equipment and devices to diversify specifications, improve productivity, and shorten delivery times, in order to achieve labor-saving, reduce manpower, enhance productivity, and increase quality value by reducing human errors. In addition to ensuring the accuracy of inspections, the miniaturization of IC products in recent years has led to higher resolution images being used for inspections, making the improvement of inspection speed and accuracy one of the challenges. CIS Corporation offers a wide range of industrial cameras that can meet diverse needs, supporting high resolution and high-speed capture. We can propose the most suitable products for various applications, including inspections in semiconductor manufacturing processes such as wafer, wire bonding, and packaging, as well as electronic circuit board appearance inspection (AOI), solder paste inspection (SPI), panel inspection, LED inspection, and electronic device inspection.
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basic information
**Product Summary** ■VCC-25CXP1M Interface: CXP6×4lanes Sensor: APS-H type CMOS 4.5μm×4.5μm Effective Pixel Count: 5120 x 5120 Frame Rate: 82fps (CXP6・8bit×4lanes), 65fps (CXP6・10bit×4lanes) Lens Mount: M48 mount Dimensions/Weight: 65(W)×65(H)×65(D)mm ■VCC-50CXP1M *Under Development* Interface: CXP12・CXP6 Sensor: 35mm type CMOS 4.6μm×4.6μm Effective Pixel Count: 7920 x 6004 Frame Rate: 30.5fps (CXP12×2lanes, CXP6×4lanes) Lens Mount: M58 mount Dimensions/Weight: 65(W)×65(H)×93.3(D)mm
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Inspection at various stages of semiconductor manufacturing such as wafer, wire bonding, and packaging, as well as electronic substrate appearance inspection (AOI), solder paste inspection (SPI), panel inspection, LED inspection, and electronic device inspection.
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CIS is a manufacturer of industrial imaging systems that consistently designs, manufactures, and sells various high-performance cameras, application products, and image processing IP. The applications of its products span a wide range, including machine vision (MV), security, medical, broadcasting, intelligent transportation systems (ITS), construction machinery, and food and pharmaceutical inspection, boasting numerous OEM adoption achievements. Leveraging features such as compact size, high speed, high performance, high reliability, and high quality, CIS continues to tackle advanced themes such as the latest digital interfaces, camera signal processing algorithms, image processing applications, and intelligent cameras, developing cutting-edge products. Focusing on embedded image processing development, CIS has developed the high-definition color image processing engine, Clairvu Engine. Additionally, the commercialization of cameras combining Clairvu Engine with 3G-SDI, HD-SDI, and CoaXPress is progressing, resulting in increased adoption. The company also has numerous development contracts for its licensing business, including algorithms and image processing software, which have been well received in the broadcasting industry, medical device industry, and construction machinery applications. Furthermore, it offers custom-designed piezo stages developed through its experience with pixel-shift cameras.