Maximize inspection efficiency! For those who want to achieve wide, detailed, and fast results.
CIS CoaXPress Camera Series / Camera Link Camera Series
A wide range of industrial cameras that are suitable for various needs such as labor-saving, reducing personnel, and increasing productivity, all capable of high resolution and high-speed capture!
With the diversification of product needs in the market, there is a demand for inspection equipment and devices to diversify specifications, improve productivity, and shorten delivery times, in order to achieve labor-saving, reduce manpower, enhance productivity, and increase quality value by reducing human errors. In addition to ensuring the accuracy of inspections, the miniaturization of IC products in recent years has led to higher resolution images being used for inspections, making the improvement of inspection speed and accuracy one of the challenges. CIS Corporation offers a wide range of industrial cameras that can meet diverse needs, supporting high resolution and high-speed capture. We can propose the most suitable products for various applications, including inspections in semiconductor manufacturing processes such as wafer, wire bonding, and packaging, as well as electronic circuit board appearance inspection (AOI), solder paste inspection (SPI), panel inspection, LED inspection, and electronic device inspection.
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basic information
**Product Summary** ■VCC-25CXP1M Interface: CXP6×4lanes Sensor: APS-H type CMOS 4.5μm×4.5μm Effective Pixel Count: 5120 x 5120 Frame Rate: 82fps (CXP6・8bit×4lanes), 65fps (CXP6・10bit×4lanes) Lens Mount: M48 mount Dimensions/Weight: 65(W)×65(H)×65(D)mm ■VCC-50CXP1M *Under Development* Interface: CXP12・CXP6 Sensor: 35mm type CMOS 4.6μm×4.6μm Effective Pixel Count: 7920 x 6004 Frame Rate: 30.5fps (CXP12×2lanes, CXP6×4lanes) Lens Mount: M58 mount Dimensions/Weight: 65(W)×65(H)×93.3(D)mm
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Applications/Examples of results
Inspection at various stages of semiconductor manufacturing such as wafer, wire bonding, and packaging, as well as electronic substrate appearance inspection (AOI), solder paste inspection (SPI), panel inspection, LED inspection, and electronic device inspection.
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Company information
CIS is a manufacturer of industrial imaging systems that consistently designs, manufactures, and sells various high-performance cameras, application products, and image processing IP. The product applications span a wide range, including machine vision (MV), security, medical, broadcasting, intelligent transportation systems (ITS), construction machinery, and food and pharmaceutical inspections, boasting a significant track record of OEM adoptions. Leveraging features such as compact size, high speed, high performance, high reliability, and high quality, we tackle advanced themes such as the latest digital interfaces, camera signal processing algorithms, image processing applications, and intelligent cameras, continuously developing cutting-edge products. We focus on embedded image processing development and have created the high-definition color image processing engine, Clairvu Engine. Additionally, we are advancing the commercialization of cameras that combine Clairvu Engine with 3G-SDI, HD-SDI, and CoaXPress, achieving successful adoption. Our licensing business for algorithms and image processing software has received numerous development commissions and has been well-received in the broadcasting industry, medical device industry, and construction machinery applications, among others.
