Low electrostatic charge, low pressure! It delivers high cleaning performance without damaging the substrate.
The "SMT-II" is a substrate cleaner that removes foreign substances from the substrate before solder printing, operating under low electrostatic and low pressure conditions. In response to the demands for traceability and centralized management in the assembly industry, it is now possible to choose IPC Hermes in addition to SMEMA as standard equipment. Furthermore, all parts of this product are meticulously designed using patented synthetic rubber roller and adhesive roll technology to achieve substrate cleaning in a low electrostatic environment. 【Features】 ■ All parts are meticulously designed using patented synthetic rubber roller and adhesive roll technology to achieve substrate cleaning in a low electrostatic environment. ■ Standard equipment includes IPC-Hermes-9852 or SMEMA to realize centralized management. ■ Simple graphic interface makes operation and settings easy. ■ High cleaning performance without damaging the substrate. ■ "Follow Me" function is available as an option. *For more details, please refer to the PDF materials or feel free to contact us.
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【Specifications】 ■Cleaning width (2 types): 40-400mm / 40-600mm ■Operating mode: Double-sided, bypass or single-sided, bypass ■Roller type: NT, UTF, Nano Clean ■Adhesive roll: AREP or AREF ■Processing speed: 1-40m/min ■Pass line height: 900±50mm ■Power supply: AC85-265V ■Required air pressure: 5-7bar, oil-free compressed air *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company name, BRUX, is derived from the German word "Bruecke," which means "bridge." As the name suggests, we strive to be a bridge connecting technology between Japan and the world, leveraging our extensive experience in international trade and the technical support we continuously accumulate to be of service to everyone.