If you have any issues with cutting techniques for various materials, please feel free to contact us!
At Shinco Manufacturing Co., Ltd., we perform "slicing processing." The cutting technology that started with a wire diameter of 120μm and diamond sizes of 15-25μm (total cutting allowance of 150μm) has now been reduced to a wire diameter of φ60μm and diamond sizes of 6-12μm (total cutting allowance of 75μm), which is half of what it was at that time. Currently, we are receiving positive feedback from customers both domestically and internationally, and we are expanding our fixed abrasive cutting technology, developed through silicon wafer processing for solar cells, into new markets. If you have any issues with cutting technology for various materials, we offer both free abrasive and fixed abrasive methods, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!