Low-pressure sealing thermosetting dry molding material Bioglass [Developed Product]
We contribute to the miniaturization of automotive components and the reduction of processes.
Mitsubishi Gas Chemical Next (formerly Nippon Yupica) has developed a low-pressure thermosetting dry molding material called "Bioglass" for encapsulation of miniaturized electronic materials, which simultaneously achieves reduced production time and low-pressure molding with insert molding capabilities. Compared to conventional materials, it allows for significant productivity improvements due to rapid curing and post-curing elimination. It contributes to the "miniaturization" and "reduction of processes" in automotive components. *For more details, please refer to the PDF document or feel free to contact us.*
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basic information
Features - High reliability - Low pressure sealing - High cycle - Post-cure less - High fluidity - Insulation and heat dissipation *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
It can be used for sealing various materials. *For more details, please refer to the PDF document or feel free to contact us.*
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Company information
Mitsubishi Gas Chemical Next (formerly Nippon Yupika) Co., Ltd. started with the unsaturated polyester resin business and has expanded into saturated polyester resins, epoxy acrylate resins (vinyl ester resins), urethane acrylate resins, and methacrylic esters. As a research and development-oriented manufacturer, we work closely with our customers to advance product development that meets their needs, providing materials widely for housing equipment, automotive and vehicle parts, electrical materials, coatings, and electronic and optical components. We also offer products that contribute to the global environment, such as resins that cure with ultraviolet or electron beams without using solvents, resins for powder coatings, and resins made from biomass materials.