■Detect the target inner layer position and perform back drilling based on that position information. ■Stable processing can be carried out while keeping the minimum stub remaining.
Inner Layer Detection Back Drill Function ■ The demand for "back drilling" to remove stubs to the target depth has been rapidly increasing due to the high-speed data communication of printed circuit boards. ■ In conventional back drilling, controlling the depth accuracy during stub processing (how effectively the stub can be removed close to the signal wiring layer) has been a challenge. ■ Our newly developed "inner layer detection back drill function" makes it possible to solve these issues. ■ By detecting the target inner layer position with a machine and performing back drilling based on that position information, stable processing can be achieved while keeping the minimum stub remaining.
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【Purchase Inquiry】【Specification Inquiry】 ■For purchase inquiries or specification details, please contact us through the inquiry section on this page.
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【Usage】 ■5G, IoT, communication board related
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.
