大船企業日本 Company Profile

Daifune Corporation Japan will exhibit at the Total Solution Exhibition for Electronic Devices 2025 held at Tokyo Big Sight. We will showcase cutting-edge laser processing technologies (femtosecond/picosecond/UV/CO2) equipped with our own developed CNC, optical, and control technologies that support advanced packaging technologies such as "FO-WLP," "FO-PLP," "CPO," and "AiP," as well as high-precision drilling technology, contour processing technology, and inspection. Please take a look at the various technologies that contribute to the advancement of embedded component technology and AI chip compatibility. [Exhibition Contents] ■ Proposals for various laser technology solutions Development/customization of customer-specific systems/optimal construction method proposals Contract processing: Support system from prototype processing to mass production ■ Proposals for drilling hole solutions Package substrate processing with 200,000 to 350,000/400,000 RPM spindle, double via hole processing HDI high-precision processing: Inner layer detection back drill function, axis CCD alignment function ■ Proposals for contour processing solutions Processing technology for optical modules: Axis CCD alignment function, counterboring processing ■ Proposals for various inspection technologies Laser blind hole inspection, hole position inspection, appearance inspection, and more.

Thanks to everyone, we have successfully concluded the publication of the "JPCA SHOW 2022 Special" with great success! Thank you to all who subscribed. The technical information featured in the "JPCA SHOW 2022 Special" will continue to be published under the new name "2022 Technical Introduction," so we would be grateful if you could download the materials and take a look. Additionally, we will be updating the "Technical Introduction" with technical documents periodically, so please be sure to check it out.

In this SHOW, we introduced various technologies and products such as "CO2 and UV laser processing technology for contract processing," "multi-purpose single-axis laser processing machine," "high-precision alignment 6-axis drilling machine and contour processing machine," "high-precision back drilling processing machine," and "high-precision contour processing machine for counterboring." You can download explanatory materials for various technologies and products, so please take a look and feel free to consult with us. 【About the Multi-Purpose Single-Axis Laser Processing Machine】 This is a custom-made multi-purpose single-axis laser processing machine where you can choose the specifications of the laser oscillator and table according to your application, including CO2, UV, Green, and IR. 【Please consult us if you have the following requests】 - I have a laser oscillator I want to use, but I can't integrate it into a machine. → We can accommodate laser oscillators such as CO2, UV, Green, and IR, so please consult with us. - I want a low-cost laser processing machine for development purposes. → We will discuss your budget and propose machine specifications. - I need a high-precision laser processing machine for developing cutting-edge products. → We will consult on the specifications and create a custom solution. - I want to conduct laser routing processing tests. → We have a demo machine equipped with a UV laser oscillator, so please consult with us.