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  1. Home
  2. Electronic Components and Semiconductors
  3. 大船企業日本
Electronic Components and Semiconductors
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大船企業日本

EstablishmentDecember 2000
capital10000Ten thousand
number of employees32
addressTokyo/Machida-shi/5-1-30 Namimachida
phone042-706-2340
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last updated:Feb 18, 2025
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  • Products/Services(141)
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大船企業日本 Company Overview

We can offer processing technologies for lasers and mechanical components, as well as inspection-related technologies related to 5G, IoT, and automotive applications, so please feel free to contact us.

At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.

Business Activities

■Sales of in-house brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines ■Development of in-house CO2/UV laser processing machines and contract processing using them ■Contract processing for laser, mechanical, and inspection (JOB SHOP business) ■Sales of various inspection equipment ■Rebuilding/modification/maintenance of used equipment

Recommended information

Contributes to maximizing productivity in a space-saving manner! 2-axis compact laser processing machine.

Contributes to maximizing productivity in a space-saving manner! 2-axis compact laser processing machine.

While reducing the installation area by approximately 65%, productivity has been doubled through simultaneous 2-axis processing. High-precision microprocessing with minimized thermal effects using picosecond lasers has been achieved.

This is a laser processing machine that maximizes the use of limited space and meets a wide range of needs from prototyping to mass production. It has the same size as a single-axis machine while achieving overwhelming improvements in throughput and precision processing quality. Optimized for the processing of precision printed circuit boards and other materials, it enables high-precision processing even in limited spaces. It achieves twice the productivity compared to single-axis machines. 【Features】 - Flexibility in installation due to compact design - Achieves double the productivity in the same space - Fine processing with low thermal impact using picosecond lasers - Compatible with various laser oscillators *For more details, please download the PDF or feel free to contact us.

Products/Services (141)

Contributes to maximizing productivity in a space-saving manner! 2-axis compact laser processing machine. product image
Contributes to maximizing productivity in a space-saving manner! 2-axis compact laser processing machine.
Laser Blind Hole Inspection Device "LaserVia AOIM" product image
Laser Blind Hole Inspection Device "LaserVia AOIM"
Ultra-high-speed hole precision measurement machine 'Hole AOI/Express' product image
Ultra-high-speed hole precision measurement machine 'Hole AOI/Express'
Laser processing machine - multipurpose single-axis laser processing machine product image
Laser processing machine - multipurpose single-axis laser processing machine

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catalog(72)

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2-Axis Compact Laser Processing Machine_Specifications

2-Axis Compact Laser Processing Machine_Specifications

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2-axis compact laser processing machine

2-axis compact laser processing machine

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Inline Laser Via Panel LaserVia AOIM

Inline Laser Via Panel LaserVia AOIM

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Ultra-high-speed hole precision measurement machine MACHVISION Hole AOI Neo

Ultra-high-speed hole precision measurement machine MACHVISION Hole AOI Neo

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news(8)

IPROS13001559722467815105.jpeg

Notice of participation in the "Electronic Devices 2026 Total Solutions Exhibition" from June 10 (Wednesday) to June 12 (Friday), 2026.

  • SEMINAR_EVENT

Daifune Corporation Japan will be exhibiting at the "Electronic Devices 2026 Total Solutions Exhibition" held at Tokyo Big Sight. This exhibition will showcase new content and solutions, including electronic circuits and mounting technologies used in various electronic, information communication, and control devices, as well as sensors and E-Textiles (wearable technology) that are expanding in application. The event aims to provide and propose technical information while contributing to the development of the entire electronic circuit industry and related sectors. We look forward to your visit.

Apr 08, 2026

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【2025年06月4日(水)~6日(金)】「第54回国際電子回路産業展」出展のお知らせ1.png

Notice of Participation in the 'Total Solutions Exhibition for Electronic Devices 2025' from June 4 (Wednesday) to June 6 (Friday), 2025.

  • SEMINAR_EVENT

Daifune Corporation Japan will exhibit at the Total Solution Exhibition for Electronic Devices 2025 held at Tokyo Big Sight. We will showcase cutting-edge laser processing technologies (femtosecond/picosecond/UV/CO2) equipped with our own developed CNC, optical, and control technologies that support advanced packaging technologies such as "FO-WLP," "FO-PLP," "CPO," and "AiP," as well as high-precision drilling technology, contour processing technology, and inspection. Please take a look at the various technologies that contribute to the advancement of embedded component technology and AI chip compatibility. [Exhibition Contents] ■ Proposals for various laser technology solutions Development/customization of customer-specific systems/optimal construction method proposals Contract processing: Support system from prototype processing to mass production ■ Proposals for drilling hole solutions Package substrate processing with 200,000 to 350,000/400,000 RPM spindle, double via hole processing HDI high-precision processing: Inner layer detection back drill function, axis CCD alignment function ■ Proposals for contour processing solutions Processing technology for optical modules: Axis CCD alignment function, counterboring processing ■ Proposals for various inspection technologies Laser blind hole inspection, hole position inspection, appearance inspection, and more.

Apr 09, 2025

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Thanks to you, we have successfully completed the publication of the "JPCA SHOW 2022 Special" with great success!

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Thanks to everyone, we have successfully concluded the publication of the "JPCA SHOW 2022 Special" with great success! Thank you to all who subscribed. The technical information featured in the "JPCA SHOW 2022 Special" will continue to be published under the new name "2022 Technical Introduction," so we would be grateful if you could download the materials and take a look. Additionally, we will be updating the "Technical Introduction" with technical documents periodically, so please be sure to check it out.

Jul 04, 2022

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Detailed information

Company name 大船企業日本
number of employees32
Contact addresspostalcode 194-0005 Tokyo/ Machida-shi/ 5-1-30 NamimachidaView on map TEL:042-706-2340 FAX:042-706-2344
Business LocationsClick here for the list
Industry Electronic Components and Semiconductors
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