Notice of Participation in the 'Total Solutions Exhibition for Electronic Devices 2025' from June 4 (Wednesday) to June 6 (Friday), 2025.

Equipped with a high-speed UV oscillator with a wavelength of 355nm! A laser processing machine that also supports ultra-small diameter processing from 10μm to 30μm.

The "Vela UV" is a laser processing machine equipped with a high-speed UV oscillator operating at a wavelength of 355nm. It performs high-speed, high-precision micro-diameter processing of printed circuit boards and other materials. Additionally, it allows for the selection of suitable laser sources based on materials and purposes. The two-axis configuration enables high-speed processing of two workpieces simultaneously. 【Features】 ■ Ability to select suitable laser sources based on materials and purposes ■ High-speed processing of two workpieces simultaneously due to the two-axis configuration ■ Capable of micro-diameter processing from 10μm to 30μm ■ Comfortable operability with in-house developed CNC ■ Support for test processing ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

In recent years, the implementation of maintenance DX to achieve "non-stop factories" has become an urgent necessity in manufacturing sites. Amid the trend of factory IoT and data utilization, the use of remote I/O, which can remotely aggregate and collect sensor information and control signals from equipment and sensors dispersed inside and outside the factory, is gaining importance as a foundation for predictive maintenance and condition monitoring. On the other hand, the installation environment for remote I/O is not necessarily limited to control panels or well-conditioned factory interiors. There is an increasing need to collect data in harsh environments, such as outdoor equipment and conditions involving high temperatures, low temperatures, vibrations, and strong electrical noise. Conventional remote I/O systems have struggled to operate stably under such conditions, requiring measures like installation location constraints and additional protective enclosures. Environmentally robust remote I/O with wide temperature support and noise resistance can address these challenges, enabling the expansion of the scope of factory IoT and predictive maintenance to outdoor and remote equipment. In this seminar, we will introduce the lineup of Contec's environmentally robust remote I/O, the "CONPROSYS(R) Robust I/O Series," which includes a total of 23 products.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Takaya Corporation will exhibit at the 27th Automatic Identification Comprehensive Exhibition, showcasing the latest RFID solution, "Visible RFID." Exhibition Details: ■ RFID Work Performance Collection System No need for a control PC or dedicated software Autonomous reader compatible with HF and UHF bands Cloud transmission with just an internet connection "Visualization" of work performance on a dashboard Integration with BI tools for "visualization of location" is also possible. ■ Newly developed "Visible RFID" autonomous reader Equipped with an LCD touch panel for on-site performance verification Efficient data management with batch transmission Experience the operability through live demonstrations We will also showcase various other products. Please visit the Takaya booth to experience the latest RFID solutions! We look forward to your visit.

[Lecture Topics] 1. Latest Trends in Information and Communication Policy of the Ministry of Internal Affairs and Communications Kei Yano, Deputy Director, Information and Communications Policy Division, Information and Communications Bureau, Ministry of Internal Affairs and Communications 2. Semiconductor and Digital Policies of the Ministry of Economy, Trade and Industry Tomonari Fujishiro, Chief of the General Affairs Section, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry / Chief of the Minister's Secretariat 3. DX Vision of the Ministry of Land, Infrastructure, Transport and Tourism Taisuke Okubo, IT Strategy Planning and Coordination Officer, Information Policy Division, Comprehensive Policy Bureau, Ministry of Land, Infrastructure, Transport and Tourism

[Speaker] Mr. Hideo Sugiura, President and CEO of RSI Co., Ltd. [Key Lecture Content] This seminar will provide a clear explanation of data centers, which are becoming increasingly important as a foundation supporting society and economic activities, from the basics. It will organize the roles of data centers and their fundamental business models, illustrating the background of market expansion and the rising demand. Additionally, it will overview the conditions required for location and buildings, as well as the characteristics of the business, highlighting perspectives that differ from conventional real estate. Furthermore, it will address the latest trends such as the proliferation of AI and the introduction of renewable energy, exploring new entry opportunities and future possibilities across various fields. [Lecture Items] 1. What is a Data Center? - The true nature of the "information infrastructure" that supports society 2. Global and Japanese Market Environment - Trends in rapidly expanding demand and investment 3. Business Models of the Industry - From hyperscalers to colocation 4. Location Conditions and Equipment Requirements - From the perspectives of power, communication, cooling, and security 5. Challenges in the Age of AI - Power, cooling, cost, and carbon-free responses 6. Future Outlook - The future of next-generation digital infrastructure and decentralized data centers 7. Q&A / Business Card Exchange