0.4mm pitch space-saving low-profile board-to-board connector
The 5806 series is a narrow pitch, ultra-low profile connector for board-to-board applications with a 0.4mm pitch and a mating height of 0.6mm, achieving a depth dimension of 1.9mm, contributing to space-saving and slim designs in equipment. While realizing space efficiency, it also provides excellent click feel and retention force. Additionally, the peel strength with the PCB has been enhanced by fixed fixtures. Furthermore, the contact area adopts a "clamping contact shape," making it resistant to vibrations and drop impacts, ensuring high contact reliability. *Please refer to the catalog for more details.*
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basic information
- This is a space-saving connector with a 0.4mm pitch, a height of 0.6mm between boards (mating), and a depth dimension of 1.9mm, contributing to the miniaturization of equipment. - The locking structure during mating is ultra-low profile while providing an excellent click feel and enhanced mating retention force. - The contact section adopts a "sandwich contact shape" (two-point contact), making it resistant to vibrations and drop impacts. Additionally, the shape of the plug contact incorporates a mechanism that increases concentrated load to eliminate foreign matter (wiping effect), achieving high contact reliability. - Compatible with automatic mounting. Delivered in embossed tape packaging containing 5,000 pieces. - Environmentally friendly, compliant with RoHS directives, and halogen-free. - Contact material: copper alloy - Insulator material: heat-resistant resin - Operating temperature range: -40°C to +85°C
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Applications/Examples of results
Smartphones, tablet PCs/laptops, wearable devices, digital still cameras/digital video cameras, AV equipment, etc.
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Kyocera offers electronic components that are installed in a wide range of devices, from everyday products like smartphones and wearable devices to industrial equipment. Utilizing cutting-edge technology and maintaining high quality throughout the development and mass production processes, we contribute to the evolution of electronics.