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  6. Impel/Impel Plus Backplane Connector

Impel/Impel Plus Backplane Connector

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last updated:Apr 07, 2026

レスター 本社
レスター 本社
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A connector that achieves both downward and upward compatibility, supporting data rates of up to 56Gbps!

The "Impel/Impel Plus Backplane Connector" is a backplane connector that achieves signal integrity and density. With a compact compliant pin design, it is compatible with various high-end architectures and minimizes impedance discontinuity with a nominal impedance of 90 Ohms. It provides a footprint and interface that allows for migration to data rates of up to 40Gbps (Impel) or up to 56Gbps (Impel Plus) without the need to completely redesign the architecture or replace hardware already installed in data centers. It also manufactures cable assemblies as a one-source solution. 【Features】 ■ Impel: Supports 25–40Gbps, Impel Plus: Supports 56Gbps ■ Nominal impedance of 90 Ohms ■ Multiple pitch options available ■ Crosstalk reduction through ground tail aligners close to daughter cards *For more details, please feel free to contact us.

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Impel

Impel/Impel Plus Backplane Connector

Impel 1.png
Impel 1.png Impel 2.png Impel3.png Impel4.png
  • Related Link - https://www.restar-ele.com/business/electronic/mol…
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basic information

【Custom Cable Assembly】 ■ Full channel solution for Impel and Impel Plus connector systems ■ Provides design flexibility according to application specifications ■ Fully automated production line and testing ■ Uses Temp-Flex Twinax cable (28 or 30 AWG) ■ Impel connector technology with tightly coupled differential pair structure *For more details, please feel free to contact us.

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Applications/Examples of results

【Industry-Specific Applications】 ■Network ■Storage ■Medtech ■Patient Monitor ■Telecommunication ■Router, Switch, Server *For more details, please feel free to contact us.

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Product Information: Impel & Impel Plus Custom Backplane Cable Assembly

Product Information: Impel & Impel Plus Custom Backplane Cable Assembly

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Impel Backplane Products

Impel Backplane Products

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Impel Plus Backplane Solutions【Product Diagram】

Impel Plus Backplane Solutions【Product Diagram】

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Impel Plus Backplane Solutions

Impel Plus Backplane Solutions

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News about this product(1)

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

  • Seminar・Event

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

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レスター

レスター 本社

Electronic Components and Semiconductors

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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.

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