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"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Lester Corporation will be exhibiting at the 'JANOG57 Meeting in Osaka' held at the Congrès Convention Center in Grand Front Osaka. This meeting is a venue for not only network operators and administrators but also a diverse range of participants to gather and discuss. We plan to showcase "Busbar," "Liquid-cooled demo units," "Expanded Beam Optical (EBO) connectors," and "other optical connectivity solutions." We sincerely look forward to your visit.

The connection system compatible with stack configurations offers single pocket and multi-pocket PCB solutions. By accommodating various circuit sizes without the need for custom tools, it significantly reduces time to market. The female connector features one of the few pressure-operated mechanisms in the industry.