Second part: Mezzanine connector connection for SoC platform [Webinar available]
Webinar: The Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers
Introducing the advantages of hermaphroditic shapes and the evolution of the PCI Express CEM Spec!
With the standardization of data center architecture by the Open Compute Project (OCP), the structure has been defined as an Open Accelerator Module (OAM), which allows for the replacement of SoCs (ASICs) and is designed to be separable as a SoC board, providing scalability. Molex's MirrorMezz has been adopted as the standard mezzanine connector for this purpose in the reference model. We have released a webinar video, so please check it out through the related link below. **Main Features of the MirrorMezz Series** - Gender-neutral shape advantageous for high-speed transmission - High-density connector utilizing solder mounting technology with BGA - Terminal arrangement designed for high-speed transmission *For more details, please download the PDF or feel free to contact us.*
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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.
