Achieving zero-level false reports and high reliability through noise removal with 3D measurement and 2D filtering, along with high camera XY position accuracy, contributing to cost reduction.
We are pleased to introduce our new product, the SPI solder printing inspection machine, ASM ProcessLens. 【Features】 ■ A high-performance SPI system equipped with a DLP (Digital Light Projector) chip featuring 8 million digitally controlled micro-mirrors. ■ Measurement without shadows is possible through moiré pattern projection and multiple light sources. ■ High-resolution 2D images, 3D on-the-fly correction for substrate warping, and extremely powerful image processing algorithms enable even more advanced measurements, achieving stabilization of the printing process and improvements in throughput and productivity. Leave it to ASMPT (formerly known as ASM Assembly Technology). *For more details, please contact us or download the PDF for more information.
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【Machine Size】 ■ 1,130 x 1,300 x 1,600 mm 【Inspection Capability】 ■ Pixel Size: 15 μm x 15 μm ■ Inspection Speed: Up to 3 cm²/second ■ Height Resolution: 0.37 μm ■ Calibration Target Height Accuracy: ≦1 μm ■ X/Y Gantry Accuracy: ±12.5 μm (±3 σ) 【Solder Paste Inspection Capability】 ■ Measurement: Shadow-free ■ Paste Measurement: Volume, Area, Height, X Offset, Y Offset, Shape, Bridging, Coplanarity ■ Maximum Paste Height: 1,000 μm ■ Minimum Paste Size: 90 x 130 μm ■ Gage R&R for Paste Applied Substrate: <<10 %
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For more details, please refer to the PDF document or feel free to contact us.
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ASM's Japan SMT Division was established in 1999 as the Electronic Production Systems Department within Siemens Corporation, and in 2011, the Electronic Production Systems Department was integrated into ASM Pacific Technology Group (ASMPT). We provide innovative and high-quality SMT solutions along with advanced technologies such as top-class printing and mounting solutions to Japanese electronic device manufacturers.