SPI solder printing inspection device 'PI Series 3D SPI'

The inspection program can be easily set up automatically, resulting in shorter training times and enabling high-quality inspections regardless of the proficiency level of the inspection operators!

The SPI solder printing inspection device 'PI Series 3D SPI' is an inspection solution that allows for the measurement of solder volume with ultra-high precision and ease. The patented Z Reference Technology captures hundreds of references with an ultra-wide 3D angle, enabling high-precision inspection measurements even for small amounts of solder. Additionally, real-time monitoring of the process is possible both online and offline. With automatic programming, accurate inspection programming can be achieved by scanning just one circuit board, ensuring high-quality inspections regardless of the operator's experience level. This inspection device is perfect for EMS providers conducting inspections of small quantities and a variety of products. 【Features】 ■ Captures hundreds of references with an ultra-wide 3D angle of 55×350mm ■ High-quality inspections possible without relying on the operator's experience through automatic programming SPI ■ Accurate measurements without misjudgment in production environments thanks to a unique warpage correction function ■ Works in conjunction with MY700 for repair functions based on PI inspection results *For more details, please refer to the PDF document or feel free to contact us.

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