Standard device for non-patterned transparent and semi-transparent wafer surface particles!
In addition to silicon wafers, double-polished transparent wafers and single-side polished translucent wafers (back matte wafers) can also be measured. You can choose between automatic transport specifications and manual transport specifications. There is an option for microscope observation that allows for review after measurement.
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basic information
Detection sensitivity: 0.1μm (bare silicon) Laser wavelength: 405nm Wafer size: 2-8 inches (up to 200mm square substrate) (There are restrictions for 12-inch measurements. Please inquire.) External dimensions: (W) 1420 x (D) 1200 x (H) 1807mm Power supply: (Electric) 100V, (Compressed air) 0.4MPa or more, 6mm quick connector; (Vacuum) -70kPa or less, 6mm quick connector; -40kPa or less, 8mm quick connector.
Price information
Please contact us.
Price range
P7
Delivery Time
Applications/Examples of results
Confirmation of particles after wafer cleaning. Contamination check of semiconductor process equipment chambers (process monitor). Confirmation of wafer and substrate shipment. Acceptance inspection of wafers and substrates. Quality inspection of deposited wafers.
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Company information
Our company was established in 1994 with the aim of developing and manufacturing inspection and testing equipment for semiconductor and liquid crystal manufacturing processes. Currently, we are focusing our business on semiconductor wafer inspection equipment, which is being adopted by a wide range of customers. In recent years, we have developed and sold particle inspection models for compound wafers that support energy-saving technologies and next-generation communications, and we are advancing into next-generation semiconductor inspection equipment. We will continue to strive to provide attractive products in the future.
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