Introducing the DPS device that generates a conductive film inside vias as a pretreatment for electroplating copper!
The device can generate a conductive coating inside vias as a pretreatment for electrolytic copper plating for blind vias and through holes. The processing surface is double-sided, and the power supply is AC 200V/220V / 50Hz/60Hz. The device configuration consists of unwinding, degreasing, micro-etching, activation, metallization, stabilization, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.0m/min (depending on specifications) ■ Material width: 70mm to 160mm (for FPC 250 to 300mm) ■ Material thickness: PI 25μm ■ Processing surface: double-sided *For more details, please refer to the PDF document or feel free to contact us.
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【Other Specifications】 ■ Utility: Power AC200V・220V / 50Hz・60Hz City water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Equipment dimensions: 15mL×2.5mW×2.5mH (approx.) *Control panel and ancillary equipment are separate *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. We will continue to operate as a group of specialists in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.
