German semiconductor venture! High-precision, high-density implementation ODM spun out from Infineon.
Our company provides advanced chip direct mounting technology for optoelectronics and sensor systems, offering a consistent contract manufacturing development process from design, process development, prototyping to mass production. We provide advanced mounting technology for various fields including electronic medical devices, industrial equipment, automatic control equipment, data processing and information communication, as well as semiconductor manufacturing equipment. In the case of unitization, high-quality unit assembly with semi-automated processes can be achieved. 【Business Content】 ■ Product and Process Development ■ Mass Production ■ Supply Chain Management *For more details, please refer to the PDF materials or feel free to contact us.
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【Various Implementation Technologies and Their Application Fields】 ■ Wafer Processing: UBM, Ball, Die Processing ■ High-Precision Chip Implementation: Flip Chip, Chip on Board ■ Component Implementation: Surface Mount ■ Unitization, Modularization: Provided in a Box 【Application Examples】 ■ CT (Computed Tomography) ■ Hearing Aids ■ Precision Lighting Equipment ■ Optical Multiplexing Devices ■ Medical Wearable Devices ■ Semiconductor Devices, Optical Signal Processing ■ Optical Sensors ■ In-Vehicle Systems ■ Pressure Sensors *For more details, please refer to the PDF document or feel free to contact us.
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Our company provides chip substrate direct mounting technology for systems requiring high-density packaging, including optoelectronics, various sensor systems, and electronic medical devices, and we conduct consistent contract manufacturing development from design, process development, prototyping to mass production. We offer advanced packaging technology in fields such as electronic medical devices, industrial equipment, automatic control devices, data processing, information communication, and semiconductor manufacturing equipment. In the case of unitization, high-quality unit assembly with the introduction of semi-automatic processes is possible.