AEMtec GmbH Company Profile

A German high-precision, high-density implementation ODM manufacturer spun out from Infineon.

Our company provides chip substrate direct mounting technology for systems requiring high-density packaging, including optoelectronics, various sensor systems, and electronic medical devices, and we conduct consistent contract manufacturing development from design, process development, prototyping to mass production. We offer advanced packaging technology in fields such as electronic medical devices, industrial equipment, automatic control devices, data processing, information communication, and semiconductor manufacturing equipment. In the case of unitization, high-quality unit assembly with the introduction of semi-automatic processes is possible.