High-precision, high-density chip direct mounting on substrates ODM [Technical and field materials provided]
We possess wafer processing, various COB, and flip chip technologies! These can be applied to ultra-small sensor systems, electronic medical devices, and optoelectronic equipment.
AEMtec GmbH offers advanced chip direct mounting technology for optoelectronics and sensor systems. We possess various mounting technologies, including wafer processing, high-precision chip mounting, component mounting, unitization, and modularization. These technologies can be applied to various ultra-small sensor systems, wearable electronic medical devices, and optoelectronic device mounting. 【Mounting Technologies We Offer】 ■ Wafer Processing: UBM, balls, die processing ■ High-Precision Chip Mounting: Flip chip, chip on board ■ Component Mounting: Surface mounting ■ Unitization and Modularization: Providing mounted substrates in special shapes *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Details of Retained Implementation Technology (Excerpt)】 〈Wafer Processing〉 ■ Under bump metallization (UBM) ■ Solder ball formation ■ Fully automated die cutting, wafer cleaning, ultraviolet irradiation ■ Gold stud bump 〈High Precision and High Density Implementation〉 ■ Flip chip, chip on board, surface mount ■ Chip on board implementation on glass substrates, VICSEL implementation, Silicon Via 〈Unitization, Modularization〉 ■ Joint development for commercialization ■ From prototyping to mass production ■ Continuous mass production and repair services ■ Worldwide shipping available *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Application Examples】 ■ CT (Computed Tomography) ■ Hearing Aids ■ Precision Lighting Equipment ■ Optical Multiplexing Devices ■ Medical Wearable Devices ■ Optical Signal Processing in Semiconductor Devices ■ Optical Sensors ■ Pressure Sensors ■ In-Vehicle Systems *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company provides chip substrate direct mounting technology for systems requiring high-density packaging, including optoelectronics, various sensor systems, and electronic medical devices, and we conduct consistent contract manufacturing development from design, process development, prototyping to mass production. We offer advanced packaging technology in fields such as electronic medical devices, industrial equipment, automatic control devices, data processing, information communication, and semiconductor manufacturing equipment. In the case of unitization, high-quality unit assembly with the introduction of semi-automatic processes is possible.