We have equipment such as cleaning devices and image dimension measuring instruments! We accept polishing processing of ceramics and other materials.
Our company applies the die-slicing processing technology we have cultivated over many years to offer cutting processing for thick products such as glass and ceramics. Using slicers and die cutters suitable for processing thick substrates, we can handle substrates with a maximum thickness of 24mm. By using materials like wax during cutting, we provide high processing accuracy and reliable quality. 【Slicing Processing】 ■ Compatible Work Sizes - Square Work: Up to 90mm (can be modified to accommodate up to 200mm) - Round Work: Up to 4 inches (can be modified to accommodate up to 8 inches) ■ Maximum Cutting Thickness: Up to 24mm (including the base material) *For more details, please refer to the PDF document or feel free to contact us.
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【Grinding Processing】 ■Supported work size: up to 100m *Please feel free to consult us about other thicknesses. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Tama Electronics Co., Ltd. has been continuing its business for about 40 years since its establishment, primarily focusing on contract processing of semiconductor assembly in the Tama region. Based on our key technology of dicing processing, we ventured into contract processing of optical components in the 2000s, transforming into a contract manufacturer handling components from electronics to opto-devices. Since 2014, we have also succeeded in developing the world's thinnest IR cut filter as our own product, and we continue to expand our business as a manufacturer of electronics and optical components, not only through contract processing but also by offering our own products. Please feel free to contact us if you have any inquiries.