We have concluded a general agency contract for domestic sales with Microflex Technology.
On October 1, 2009, Hughes TechnoNet and (U.S.) Microflex Technology signed a general sales agency agreement in Japan. MicroSeal is a C-seal type O-ring that seals the substrate block and mounted components of integrated gas panels for semiconductor manufacturing equipment. MicroSeal is standardly adopted in 300mm equipment from major U.S. semiconductor manufacturers AMAT and LAM, and is used by device manufacturers worldwide. *For more details, please refer to the PDF materials or feel free to contact us.
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The current needs require us, on the supply side, to dig deeper in certain areas. Hughes TechnoNet believes that we are entering an era of development proposals where we actively present our unique technologies, cultivated across various industries, to our customers. The accumulated technology creates products, the development of those products leads to the next technology, and that technology further connects to the next advanced products... Hughes TechnoNet is poised to take flight with a vision of a new "challenge to creation," based on our accumulated fluid control technology.