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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Automatic Grinding Machine "MECATECH 334SPC"

Automatic Grinding Machine "MECATECH 334SPC"

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last updated:Aug 29, 2022

北川グレステック 本社
北川グレステック 本社
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The price is back at a low cost! Introducing the upgraded automatic polishing machine MECATECH 334.

The "MECATECH 334SPC" is an automatic polishing machine capable of mounting φ250 and 300mm discs with six cylinders. It is a high-spec model that allows for both central and individual loading methods. This device has been arranged based on an older model, achieving a more accessible price. For those who have found the high cost of automatic polishing machines out of reach until now, we encourage you to consider this opportunity. 【Features】 ■ Compatible with polishing discs of 250 and 300φ ■ Touch panel and other features have been updated while maintaining the ease of use of the old model ■ Supports both manual and automatic polishing ■ Guarantees suitable polishing regardless of the size or number of samples ■ Selection of models and holders tailored to your budget is also possible *For more details, please refer to the PDF materials or feel free to contact us.

    Wafer processing/polishing equipment
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Automatic Grinding Machine "MECATECH 334SPC"

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  • Related Link - http://www.kemet.jp/

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【Other Features】 ■ It is possible to program the grinding amount in overall load grinding. ■ A very accurate linear gauge measures the movement of the cylinder. ■ Frees the operator from tedious tasks. ■ The air pressure can be accurately measured and stabilized by an electromagnetic valve. ■ The pressure applied to the sample is always constant, which helps improve reproducibility. ■ The lubricant is automatically applied by a tank equipped with a pump. *For more details, please refer to the PDF document or feel free to contact us.

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Automatic Grinding Machine 'MECATECH 334SPC'

Automatic Grinding Machine 'MECATECH 334SPC'

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北川グレステック

北川グレステック 本社

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Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.

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