Automatic optical inspection equipment for semiconductor device products! Ideal for high-speed evaluation of inner cracks!
High-resolution camera compatible with various wire bonding, die bonding evaluations, and large-diameter wafer bump evaluations!! Compatible with all semiconductor devices such as FOUPs, cassettes, and magazines. *For product details, please refer to the catalog available for download below "PDF Download."
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basic information
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Applications/Examples of results
Wire Bonding Evaluation Ball Bond Diameter Stitch Width Short No Touching of Bond of Pad Edge Bump/Ball/Stitch Lifting Ball Smearing Cannot Touch Pad Edge Neck Broken Abnormal Ball Shape Chip Evaluation Die Shift Die Rotation Missing Die Insufficient Epoxy
Detailed information
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High-speed inspection of inner cracks is possible with SWIR!!
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Company information
Our company not only provides PCBA testing and inspection products but also offers installation at customer sites, testing and inspection that meet customer satisfaction, and after-sales service worldwide, all conducted by highly trained and experienced Field Application Engineers (FAEs). Currently, our appearance inspection equipment and X-ray inspection equipment hold approximately half of the market share in Taiwan and China, with many of our products having received the Taiwan Symbol of Excellence Award, gaining recognition and strong support from major international companies and top global enterprises.
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