Atom E3950/E3940/E3930/Pentium N4200/Celeron N3350
Features ■ Thin Mini ITX standard motherboard equipped with 14nm Intel(R) Pentium(R)/Celeron(R) onboard SoC processor ■ Supports DDR3L SO-DIMM ■ Capable of independent triple display ■ Full-size PCIe mini slot and SIM socket included ■ Compatible with Windows 10 OS ■ Supports COM, USB 3.0, SATA 6Gb/s, and audio ■ Ideal for OS backup and recovery with IEI One Key Recovery solution
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Specifications ■SoC: Pentium N4200 (up to 2.5GHz, quad-core, 2M Cache, TDP=6W), Celeron N3350 (up to 2.4GHz, dual-core, 2M Cache, TDP=6W) ■Memory: 204-pin 1867/1600MHz Dual-channel DDR3L DIMM x 2 slots (up to 8GB) ■Display: eDP x 1, DP++ x 2 ■Rear I/O: Gigabit LAN x 2, USB 3.0 x 4, audio jack x 1 (line-out, mic-in) ■Built-in I/O: KB/MS x 1, M.2 (B key) x 1, RS-232/422/485 x 2, USB 2.0 x 2, RS-232 x 4, SATA 6G/s with 12/5V SATA power connector x 2 (non-RAID), front audio x 1, speaker x 1, DIO, TPM ■Expansion: PCIe (1) x 1 slot, full/half size PCIe mini card x 1 ■Power Input: Single 12V DC ■Operating Temperature: -20°C ~ 70°C ■Operating Humidity: 5% ~ 95% (non-condensing) ■Dimensions: 170mm x 170mm
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Delivery Time
P4
Applications/Examples of results
Factory and Building Automation / Multimedia Systems / Digital Signage
Line up(2)
Model number | overview |
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tKINO-AL-N1-R10 | Thin Mini-ITX SBC supports Intel 14nm dual-core Celeron N3350 2.4GHz on-board SoC with DP++, Dual PCIe GbE, USB 3.0, PCIe Mini, M.2, SATA 6Gb/s, COM, Audio and RoHS |
tKINO-AL-N2-R10 | Thin Mini-ITX SBC supports Intel 14nm quad-core Pentium N4200 2.5GHz on-board SoC with DP++, Dual PCIe GbE, USB 3.0, PCIe Mini, M.2, SATA 6Gb/s, COM, Audio and RoHS |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.