At SETO ENGINEERING, we specialize in the design and manufacturing of various types of plating equipment, utilizing roll-to-roll technology!
As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. In the future, we will operate as a group of specialists in roll-to-roll manufacturing equipment. Among our strengths is the design and manufacturing of "plating equipment." We utilize roll-to-roll manufacturing technology to accommodate various types of plating. 【Manufactured Equipment Achievements】 ● Melting Copper Plating Equipment This equipment can perform electrolytic copper plating on blind vias and through holes. The material thickness ranges from PI 25μm and the material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. ● Electrolytic Copper Plating Equipment (Non-Melting Copper Plating) Copper plating can be applied to the product pattern sections. The process includes pre-treatment of the film foil, copper plating, rinsing, and drying, conducted in a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the equipment, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). Basic information on other types of plating equipment is provided.
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●Electroless Copper Plating Equipment Copper plating can be performed using an electroless method on a "conductive ink" pattern formed in a resin film. Thin materials are transported without scratches or wrinkles using our transport technology. By adopting an UP/DOWN processing method for the treatment section, it is possible to shorten the overall length of the equipment. ●Electroless Tin Plating Equipment This is a device for electroless tin plating on wiring patterns. The transport speed is 2.0 m/min, and the material width ranges from 35 mm to 160 mm for TAB/CSP/COF and 250 to 300 mm for FPC. The equipment consists of unwinding, pre-treatment, tin plating, post-treatment, hot washing, rinsing, liquid draining, drying, and winding. ●Electrolytic Ni/Au Plating Equipment This is a device for electrolytic Ni + Au plating on wiring patterns. The transport speed ranges from 1.0 m to 2.0 m/min, and the material width is 35 mm to 160 mm for TAB/CSP/COF and 250 to 300 mm for FPC. The equipment consists of unwinding, pre-treatment, Ni plating, Au plating, hot washing, rinsing, liquid draining, drying, and winding. *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. We will continue to operate as a group of specialists in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.