The transport speed is 1.0m to 2.0m/min, and the material thickness is compatible with PI 25μm and above! Introducing our electroplated Ni/Au equipment.
This product is a device for electroplating Ni + Au on wiring patterns. The transport speed is 1.0m to 2.0m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding → pretreatment → Ni plating → Au plating → hot water rinse → water rinse → liquid draining → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. We will continue to operate as a group of specialists in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.
