Outsourced Automatic Visual Inspection Service for Reducing Inspection Costs and Improving Quality of Implementation Boards
We also accept visual inspections of circuit boards manufactured by other companies, in addition to those designed and produced by us. Please feel free to contact us.
This is a service that automatically performs visual inspections of printed circuit boards equipped with surface-mounted components and detects defects. Through automated inspection, it achieves improvements in quality, reductions in labor costs, and shorter inspection times. 【Main Inspection Target Items】 Differences in product names, differences in components, missing components, damaged components, polarity differences, placement differences, positional misalignment, component lifting, tilting, chip standing, solder ball detection, solder bridges, and unsoldered areas. *For more details, please download the PDF or feel free to contact us.
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【Specifications of Automatic Visual Inspection Equipment】 ■ Manufacturer: MIRTEC ■ Model Number: MV-3L ■ Supported Board Size: 50×50 to 500×400 [mm] ■ Minimum Component Size for Inspection: 0603 Chip [mm] / 0201 Chip [inch] / 0.4 Pitch [mm] ■ Inspection Resolution / FOV: Pixel Resolution 13.4 [μm] / 49.09 × 36.66 [mm] ■ Inspection Speed: 0.34 [sec / FOV] ■ Top and Bottom Clearance: 45 [mm] *For more details, please download the catalog or contact us.
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With over 30 years of experience in the design and production of systems, devices, packages, and modules centered around wireless technology through ODM, OEM, and EMS, we have provided products ranging from reliable devices to embedded products. We possess extensive experience in responding to both public market products and industrial market products, focusing on wireless technology, and accommodating a wide variety of low-volume embedded and standalone products. Furthermore, we offer comprehensive support not only in manufacturing but also in design, on-site adjustments and testing, maintenance, and repair. Moving forward, we will continue to support our customers in the IoT market with combinations of wireless and imaging technologies, as well as wireless and sensor technologies.