Atmospheric pressure plasma surface treatment device for direct bonding technology for the FCCL market.
Precise Series
Atmospheric pressure plasma device enabling direct bonding in the 5G and 6G FCCL market.
There is a rapidly increasing demand for substrate materials in the FCCL market for millimeter-wave devices, and a technology that allows for direct adhesion without roughening the surface is required. Our company's downstream atmospheric pressure plasma equipment focuses on molecular bonding, enabling processing that causes no damage to the surface or any scientific damage from UV light or other effects of plasma. Our "Precise" system separates the plasma generation unit from the processing unit (downstream type), allowing for the addition of functional groups and hydroxyl groups to the surface without damaging the processing area. This enables direct adhesion to liquid crystal polymers (LCP) and fluororesins while maintaining a smooth surface. Since our plasma treatment for adhesion and bonding is based on molecular bonding, it can be performed without causing any damage to the surface or any scientific damage from UV light or other effects of plasma. Additionally, by performing a pre-treatment for electroless plating through plasma treatment, we improve the dispersion of the catalyst and achieve uniform copper plating. For more details, please contact us or download the catalog.
Inquire About This Product
basic information
We are conducting sample work at our lab. Please feel free to contact us.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or download the catalog.
catalog（4）
Download All Catalogs
![[Data] Advantages of Atmospheric Pressure Plasma Surface Modification and Its Equipment ver: 2](https://image.mono.ipros.com/public/catalog/image/01/684/435066/IPROS5328161188556745263.jpeg?w=120&h=170)
Company information
We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.