5G-compatible printed circuit boards and FCCL using atmospheric pressure plasma devices.
Precise Series
Direct bonding technology and electroless plating pretreatment to reduce transmission loss!
We contribute to the manufacturing processes of printed circuit boards and FCCL for 5G and 6G using atmospheric pressure plasma devices. Our "Precise" system separates the plasma generation unit from the processing unit (downstream type), allowing us to impart functional groups and hydroxyl groups to the surface primarily through molecular bonding without damaging the processing area. This enables direct adhesion to liquid crystal polymers (LCP) and fluorine resins while maintaining a smooth surface. Since our plasma treatment focuses on molecular bonding, it allows for processing without any damage to the surface or scientific damage from UV light and other effects of plasma. We are conducting sample work on damage-free direct adhesion to various films. According to our experimental data, the adhesion strength achieved is over 9N/cm (Cu/LCP). The adhesion strength on Ni surfaces can be improved by arranging amine groups on the surface. These treatments can be easily achieved by changing the added gases.
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basic information
The specifications and sales price will vary depending on the plasma length (width). Please let us know your desired plasma width (processing width). We can manufacture widths from 100 mm to 3000 mm. Tabletop experimental machines can be produced, and on-site experiments are possible.
Price information
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Applications/Examples of results
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Company information
We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.