Prevention of powder adhesion and improved sieving efficiency: "Ultrasonic Sieving Unit"
Artec Ultrasonic Sifter
Eliminate powder clogging and adhesion issues! Reduce classification time. *Demo units available for free rental.
The "Ultrasonic Sieve Unit" transmits special ultrasonic vibrations to each individual stainless steel mesh wire, resolving issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. It improves the classification efficiency in powder sieving processes and contributes to time savings! It achieves dry sieving with high mesh sizes such as 20μm and can be installed on mass production machines ranging from standard JIS mesh frames to large Φ1200 models. ★ We will be exhibiting at the 2022 Powder Industry Exhibition in Tokyo. Please refer to the basic information for details. 【Features】 ■ Prevents issues with special "sweep vibrations (30kHz to 38kHz)" ■ Compatible with various applications from lab-scale to mass production machines ■ Excellent maintenance, maintaining the quality of mesh screens over long-term vibrations ■ Dustproof and waterproof (CE certified, IP65 structure) ■ Easy installation with clamp hand tools of various dedicated sizes (Φ50, 75, 100, 150, 200, 300, etc.) * For more details, please refer to the PDF materials and the product introduction video on YouTube. Feel free to contact us with any inquiries.
Inquire About This Product
Related Videos
basic information
【2022 International Powder Technology Exhibition Tokyo】 ■Venue: Tokyo Big Sight ■Date: December 7 (Wednesday) - 9 (Friday), 2022 ■Booth Number: To be updated regularly We look forward to your visit. 【Ultrasonic Oscillator (DGS Model) Specifications】 Operating Frequency Range: 30kHz - 38kHz Maximum Output: Φ50-250: 50W, Φ300-400: 100W Power Supply: Single-phase 100V, 200V, 230V ±10% (50Hz/60Hz) multi-power supply built-in Weight: DGS Model 3.4kg, PNS Model 3.2kg Dimensions: Length 170mm x Width 280mm x Height 124mm (※PNS height 91mm) Environmental Temperature: 0℃ - 45℃ (Humidity below 80% at 30℃) Safety Standards: CE, IP65 structure 【Ultrasonic Converter (C35-SD8 Model) Specifications】 Maximum Output: 120W (C35-SD8) Material: Titanium Alloy Body (C35-SD8) Weight: 270g 【Clamp Band Fixture Specifications】 Material: SUS304 (Option SUS316L) Compatible Sizes: Φ50, Φ75, Φ100, Φ150, Φ200, Φ250, Φ300, and other sizes
Price range
Delivery Time
P4
Applications/Examples of results
【Applications】 ■Coatings ■Battery materials ■Metal materials ■Resin materials ■Pharmaceutical materials/Food materials ■Toners ■Chemical products etc. *For more details, please refer to the PDF document or feel free to contact us.
Line up（4）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
catalog（5）
Download All Catalogs
![Ultrasonic sieve machine [suitable for transportation, supply, cleaning, and molds!]](https://image.mono.ipros.com/public/catalog/image/01/0e3/33836/IPROS17583223056302832027.PNG?w=120&h=170)
![[Latest Edition] Free Comprehensive Catalog from UC Japan Co., Ltd.](https://image.mono.ipros.com/public/catalog/image_generated/01/d75/364145/364145_IPROS6167932514340624170_1.jpg?w=120&h=170)
Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
