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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Precision Grinding Device "MA-200e"

Precision Grinding Device "MA-200e"

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last updated:Jun 15, 2023

ムサシノ電子
ムサシノ電子
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Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

    Other processing machinesWafer processing/polishing equipment
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Precision Grinding Device "MA-200e"

2020-09-29_15h25_36.png
2020-09-29_15h25_36.png
  • Related Link - https://www.musashino-denshi.co.jp/grinder/kenma/m…

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【Examples of Materials with Processing Achievements】 ■ Semiconductor materials (silicon, germanium, silicon carbide, strontium silicate, gallium arsenide, indium gallium arsenide, indium phosphide, indium gallium zinc oxide, gallium nitride, gallium oxide, cadmium telluride, etc.) ■ Optical materials (quartz glass, sapphire, fluorite lenses, spinel, phosphate glass, lithium borate, acrylic resin, CLBO, YiG, GGG, etc.) ■ Ceramic materials (alumina, zirconia, silicon nitride, ferrite, etc.) ■ Metal materials (steel materials, stainless steel, copper, gold, silver, platinum, aluminum, titanium, molybdenum, etc.) *For more details, please refer to the PDF document or feel free to contact us.

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【Purpose】 ■ Sample preparation for research and development ■ Inspections by the quality assurance department ... etc. * For more details, please refer to the PDF document or feel free to contact us.

catalog(13)

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Precision Grinding Device "MA-200e"

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Precision Grinding Device "MA-150"

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Precision Grinding Device "MA-200"

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Precision Grinding Device "MA-300e"

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Automatic Spray Device "MS-2"

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Adhesive flat panel

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Company information

ムサシノ電子

ムサシノ電子

Industrial Machinery

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Our company has been manufacturing polishing equipment, cutting machines, and scribers suitable for precision machining using the technical know-how we have cultivated over many years. We have a significant track record, particularly in cutting-edge technology fields such as semiconductors, ceramics, and optical communications. In addition to standard specification equipment, we also accept the design and manufacture of custom specifications tailored to our customers' needs. To meet the increasing demands for precision in machining and the diversifying needs, we will continue to advance with innovative ideas and technology.

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