Resin hole-filling ink removal device

Cost reduction through compactification! It enables the shortest wiring compared to using through-hole patterns.

This product is a resin filling ink removal device that achieves a 30% improvement in mounting density for permanent hole filling. It allows for a reduction in the number of layers (e.g., from 6-layer boards to 4-layer boards) and can reduce costs through compacting. Additionally, it has noise suppression effects and eliminates the need for through holes between layers, which is highly beneficial for substrates with a high number of pins in BGA (Ball Grid Array) configurations. 【Features】 ■ Noise suppression effect ■ Reduction in the number of layers possible ■ Approximately 30% improvement in mounting density ■ Cost reduction through compacting ■ Enables the shortest wiring compared to using through hole patterns *For more details, please refer to the PDF document or feel free to contact us.

Wafer processing/polishing equipment