Versatile and easy-to-use non-woven fabric pads.
"SUBA(TM)" is a non-woven pad that demonstrates high performance, stability, and reliability as a polishing pad compatible with various types of substrates, from silicon wafers and glass substrates to GaN and SiC substrates. It achieves an ideal polishing finish with a wide lineup that can accommodate various applications. We respond to various requests, including hard types that emphasize flatness and soft types that focus on planarity. 【Features】 ■ A non-woven pad characterized by a high polishing rate, used for a wide range of polishing targets ■ More than 10 standard types available ■ High hardness and high density pads improve finishing flatness ■ Low hardness and low density pads reduce defects *For more details, please download the PDF or feel free to contact us.
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basic information
【Lineup】 ■SUBA(TM)400 ■SUBA(TM)400H ■SUBA(TM)600 ■SUBA(TM)800 ■SUBA(TM)800K3 ■SUBA(TM)808 ■SUBA(TM)840 ■SUBA(TM)800M2 ■SUBA(TM)800M4 *For more details, please download the PDF or feel free to contact us.
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【Usage】 ■ Polishing of silicon wafers, quartz, crystals, metals, sapphires, and substrates such as LT, LN, AIN, GaN, and SiC. *For more details, please download the PDF or feel free to contact us.
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At Anchor Tech Co., Ltd., we offer a wide range of proposals that meet our customers' needs, including CMP/polishing pads with an extremely high track record both domestically and internationally, such as IC1000 and SUBA, as well as CMP/polishing slurries, work holding materials (templates/backing materials), conditioners, and more. Additionally, we provide sales and rentals of measurement equipment such as particle counters, TOC meters, pressure distribution measurement devices, and rapid microbial testing kits, so please feel free to contact us if you have any requests.
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