Focusing on materials and design to achieve long life and high quality. Pursuing strict dimensional tolerances for high precision and stable discharge.
Micro Point Pro Co., Ltd. designs and manufactures the "Solder Jet Ball Dispenser," which is widely adopted in fields such as mobile phones, 5G, and IoT. We carefully select materials to achieve long life, and we provide high-quality products with strict dimensional tolerances. We also respond flexibly to delivery requests. ★Announcement of the Special Olympics Support Campaign★ During the period of the Olympic Games, we will offer all products handled by Micro Point Pro Co., Ltd. at special prices. ? For details, please contact us via email or phone. ? *You can download the English version of the catalog.*
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basic information
We offer a variety of products in addition to the "Solder Jet Ball Dispenser." 【Main Products】 ◎ Dispensers & SMT Nozzles ◎ Probe Heads for Wafer Resistance Measurement ◎ Pick & Place Flip Chips ◎ Manual Wire Bonders ◎ Small & Large Wire Wedges ◎ Die Collets ◎ Special Ceramics & Hard Metal Products 【Application Examples】 ■ HGA/HSA Assembly for Hard Disk Drives ■ Camera Assembly for Mobile Phones ■ Wafer Bumping *You can download the English version of the catalog.
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You can download the English version of the catalog.
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.
