Special design to support the development roadmap! Applicable to mobile phone camera assembly and more.
We would like to introduce the "Solder Jet Ball Dispenser Nozzle" that we handle. It is a standard technology in hard disk drive manufacturing and is also applicable to other major applications such as mobile phone camera assembly and wafer bumping. It features excellent materials and tool specifications to extend tool life, as well as special designs that support the development roadmap. 【Features】 ■ Excellent materials and tool specifications to extend tool life ■ Special designs that support the customer's development roadmap ■ Ultra-tight tolerances on critical dimensions that enable improved manufacturing yield ■ Unmatched quality and repeatability between tools ■ Support for all OEM machines, including Pactech, Laservall, and Hans Laser *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（2）
Download All Catalogs
Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.
![[Exhibition] Monozukuri World Tokyo 2026 | Seminar Held](https://image.mono.ipros.com/public/default/object/noimage_l.gif?w=280&h=280)
