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  6. Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Product)

Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Product)

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last updated:Oct 28, 2020

KISO WAVE
KISO WAVE
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It is suitable for applications such as high-frequency low transmission loss substrates (5G communication) and MEMS/sensor substrates!

We would like to introduce our technology for "Quartz Glass Micro-Hole Formation and Metal Filling." It is possible to achieve glass vias without micro-cracks and glass vias with metal filling that are voidless. We can provide flatness for both the glass top surface and the metal top surface. This technology is suitable for applications such as high-frequency low transmission loss substrates (5G communication), high-density flip chip mounting substrates, and MEMS/sensor substrates. 【Features】 ■ Glass vias without micro-cracks ■ Glass vias with voidless metal filling ■ Flatness of glass top surface and metal top surface ■ Wiring patterns on both sides of the glass and multilayer wiring can also be produced *For more details, please refer to the PDF document or feel free to contact us.

    Processing Contract
2020-10-27_16h22_43.png

Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Product)

2020-10-27_16h22_43.png
2020-10-27_16h22_43.png

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【Substrate Details】 ■Synthetic quartz substrate: φ4 inches × 0.22 mm thick ■Through hole diameter: φ40 μm ■Through hole pitch: 150 μm ■Through holes filled with metal without voids *For more details, please refer to the PDF document or feel free to contact us.

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【Applications】 ■ High-frequency compatible low transmission loss substrate (5G communication) ■ High-density flip chip mounting substrate ■ MEMS/sensor substrate ■ M-LED and other display device substrates *For more details, please refer to the PDF document or feel free to contact us.

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Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Products)

Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Products)

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KISO WAVE

KISO WAVE

Electronic Components and Semiconductors

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In 1983, we were established as a thin film metal patterning factory of Micron Technology Research Institute, focusing on LCD substrates and PDP substrates, and have been producing cutting-edge products using photolithography and etching technologies. In 2007, we became a separate company as Kiso Micro Co., Ltd., enhancing our commitment to challenge ourselves with more creative products and aiming to be a trusted company by our customers as a company that can create for the future. Please utilize our services from development to mass production.

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