Remove lead plating from non-RoHS parts containing lead.
Remove the plated lead from the terminal sections such as QFP and SOP to make it usable with lead-free substrates.
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basic information
As an alternative for EOL, discontinued, and obsolete parts, we will remove the lead from lead-plated QFPs and SOPs at the terminal section to make them lead-free compliant. Non-RoHS parts will be able to be used as RoHS-compliant parts.
Price range
P1
Delivery Time
P2
Applications/Examples of results
As a substitute for EOL, discontinued, and obsolete components, we will remove the lead from lead-plated QFPs and SOPs at the terminal section to make them lead-free compliant. Non-RoHS components will be able to be used as RoHS-compliant components.
Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.