Supports a variety of specifications, including compatibility with multiple impedance control specifications!
The "HDI substrate" is a printed circuit board created by forming copper circuit wiring on the surface of a resin board, stacking multiple layers, and then heating and bonding them together. It can accommodate a variety of specifications, including 4 to 54 layers, thicknesses from 0.5mm to 6.3mm, and multiple impedance control specifications. There are multilayer structures such as "IVH substrates," which use vias that connect only specific layers, and "build-up substrates," which create multilayer printed circuit boards by laminating each layer, laser drilling, and forming wiring and vias repeatedly. 【Features of IVH substrates】 ■ A method for producing multilayer printed circuit boards using vias that connect only specific layers. ■ Can improve integration density. *For more details, please refer to the PDF materials or feel free to contact us.
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【Build-Up Substrate Features】 ■ A method for producing multilayer printed circuit boards by stacking each layer, performing laser drilling, and forming wiring and vias repeatedly. ■ Allows for higher integration due to greater freedom compared to IVH substrates. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.