Introducing products suitable for those looking to produce a small quantity of ultra-thin rigid substrates!
We would like to introduce our "Ultra-thin Substrate" that we handle. Detailed designs tailored to customer requirements are possible through layer composition, copper foil thickness, and lamination methods. It has become an ultra-thin printed circuit board while maintaining the characteristics of rigid substrates. It can accommodate a wide range of methods, including build-up processes and through-hole technology, and unlike flexible substrates, it possesses both the electrical characteristics and strength of rigid substrates. 【Features】 ■ Innovative substrate materials and methods for 4-layer and 6-layer designs ■ Detailed designs tailored to customer requirements through layer composition, copper foil thickness, and lamination methods ■ Accommodates a wide range of methods, including build-up processes and through-hole technology ■ An ultra-thin printed circuit board that maintains the characteristics of rigid substrates ■ Unlike flexible substrates, it combines the electrical characteristics and strength of rigid substrates *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Layer Structure】 ■4 layers: t0.12mm ■6 layers: t0.2mm ■4 layers: t0.095mm ■6 layers: t0.13mm *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
[Applications] ■ Substrates for products that aim to reduce the overall thickness, such as wearable products and ultra-thin electronic device modules - Substrates for electronic devices - Substrates for functional modules *For more details, please refer to the PDF document or feel free to contact us.*
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Company information
Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.
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