Microcircuit "High-Density Substrate"

Stable peel strength can be achieved regardless of the substrate type! The semi-additive method accommodates fine patterns.

Our "High-Density Substrate" utilizes a semi-additive process to accommodate fine patterns. We employ a 5μm copper foil known as UTC for primary copper, achieving stable peel strength regardless of substrate type, and preventing abnormal gold plating due to palladium residue. Additionally, by adopting via-fill plating for electro-copper plating, we minimize variations in plating thickness and accommodate filled vias. With an any-layer stack structure and multi-stage build-up wiring boards at its core, we respond to various substrate needs from double-sided boards to multilayer boards. 【Features】 ■ Peel strength of 10N/cm or more ■ Adoption of via-fill plating for electro-copper plating *For more details, please refer to the PDF document or feel free to contact us.

Printed Circuit Board