Sales of solder paste printers compatible with narrow and narrow-pitch applications with a printing accuracy of ±10μm, as well as contract services such as bumping!
The "Solder Paste Printer TD-4420" is a paste press-in type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide optimal printing conditions for a wide range of printing needs. By realizing "hybrid squeegeeing," which combines contact printing and off-contact printing, we challenge the limits of screen printing. The metal mask cleaner is equipped with both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main Equipment) - Solder Paste Printer "TD-4420" - N2 Reflow Oven - Flux Cleaning Machine - Flattening Device - Bump Height Measurement Device - X-ray Observation Device (Main Solder Bumping Achievements) - Graphic Memory - Automotive Microcontrollers - Analog Devices - Data Storage Memory *For more details, please refer to the PDF document. Evaluation demos in a Class 10,000 clean room are also available. Please feel free to contact us.
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basic information
(Squeegee Unit Features) ■ The configuration of storing paste in a cartridge shielded from outside air helps prevent deterioration such as oxidation. ■ The rotation pressure of the roller shaft inside the cartridge ensures that the paste is reliably filled into the mask opening. ■ The automatic replenishment and automatic stirring functions maintain a constant amount of paste and paste viscosity inside the cartridge. ■ The printing method that leaves no paste on the mask after squeegeeing allows for a reduction in paste loss. (Metal Mask Cleaner Features) ■ Both dry and wet cleaners achieve stable cleaning effects with a sandwich structure that contacts both sides of the metal mask. ■ The wet cleaner employs a thorough washing method that completely removes paste particles and flux residues from within the mask openings. (Examples of 'TD-4420' Adoption) ■ Formation of solder bumps on flip chip interposers (bump pitch 150–200μm) ■ Formation of solder bumps on wafers for printing devices (bump pitch 120–150μm) ■ Formation of solder bumps on wafers for communication devices (bump pitch 150–170μm) ■ Filling of conductive paste into via holes of substrates for optical devices (via diameter 250–300μm)
Price range
P7
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our business consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. Our strength lies in providing one-stop services from assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to unit assembly and repair services for touch panels and display products. Additionally, we are capable of producing products certified under ISO9001, ISO14001, as well as ISO13485 for medical devices and UL standards. On the other hand, in the semiconductor related business, we have solved many customer challenges with our advanced printing technology and know-how. We are developing a business model where our main SMT related business and semiconductor related business are supported by the product development business from both software and hardware perspectives.