Solder paste printer "TD-4420" & bumping service

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last updated：Sep 02, 2021

谷電機工業

Official site

A must-see for electronic device manufacturers! Sales of solder paste printers compatible with narrow and fine pitch, with a printing accuracy of ±10μm, and contract services such as bumping!

The "Solder Paste Printer TD-4420" is a paste insertion type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide optimal printing conditions for a wide range of printing needs. By realizing "hybrid squeegeeing," which combines contact printing and off-contact printing, we challenge the limits of screen printing. The metal mask cleaner is equipped with both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main equipment) - Solder paste printer "TD-4420" - N2 reflow oven - Flux cleaning machine - Flattening device - Bump height measurement device - X-ray observation device (Main solder bumping achievements) - Graphic memory - Automotive microcontrollers - Analog devices - Data storage memory *For more details, please refer to the PDF document. Evaluation demos in the clean room (Class 10,000) are also possible. Please feel free to contact us.

Related Link - https://www.tanidenki.co.jp/products/handotai/

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basic information

(Squeegee Unit Features) ■ The configuration stores paste in a cartridge shielded from outside air, preventing deterioration such as oxidation. ■ The rotation pressure of the roller shaft inside the cartridge ensures reliable filling of the paste into the mask opening. ■ The automatic replenishment and automatic stirring functions maintain a constant amount and viscosity of the paste inside the cartridge. ■ The printing method does not leave paste on the mask after squeegeeing, allowing for a reduction in paste loss. (Metal Mask Cleaner Features) ■ Both dry and wet cleaners achieve stable cleaning effects with a sandwich structure that contacts both sides of the metal mask. ■ The wet cleaner employs a thorough washing method that completely removes paste particles and flux residues from the mask openings. (Examples of 'TD-4420' Adoption) ■ Formation of solder bumps on flip chip interposers (bump pitch 150–200μm) ■ Formation of solder bumps on wafers for printing devices (bump pitch 120–150μm) ■ Formation of solder bumps on wafers for communication devices (bump pitch 150–170μm) ■ Filling of conductive paste into via holes of substrates for optical devices (via diameter 250–300μm)