Implementation technology that can accommodate various package products such as QFP, BGA, and CSP!
Our company, as a specialized manufacturer of semiconductor surface mount technology, provides high-quality and highly reliable products. We have established high-speed, high-density mounting lines to offer mounting technologies that align with market needs and timing. Products assembled in a safe and clean working environment, equipped with advanced facilities and thorough electrostatic prevention measures, are used in computers, electronic exchanges, audio equipment, and various other electronic devices. Please feel free to contact us if you have any inquiries. 【Overview】 ■ SMT Lines: 3 lines ■ Board Size: 50×50mm to 460mm×380mm ■ Chip Size: 0603 to CSP, BGA ■ Bond Dispenser: Inline 2 series ■ N2 Compatible *For more details, please download the PDF or feel free to contact us.
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【Main Equipment】 ■Insert Machine ■Printing Machine ■Dispenser ■High-Speed Mounter ■Shape Machine ■Reflow Oven ■Communication Computer ■Solder Bath ■Spray Fracture ■ICT ■Forming Machine ■Auto Cutter ■Program Creation Machine ■Appearance Inspection Equipment, etc. *For more details, please download the PDF or feel free to contact us.
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Our company is capable of automatic and manual insertion of discrete components from surface mount on substrates, and we can accommodate lead-free flow solder (with the introduction of low-silver flow solder) as well as leaded flow solder. Additionally, we offer comprehensive ICT and FCT inspections, enabling consistent production with the capability to establish assembly processes. Please feel free to contact us if you have any requests.