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  6. [Circuit Board Manufacturing Case] Fine Patterning by Direct Drawing

[Circuit Board Manufacturing Case] Fine Patterning by Direct Drawing

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last updated:Dec 14, 2020

東洋精密工業
東洋精密工業
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We were able to create fine patterns at the "L/S=5μm" level, which cannot be produced with conventional patterning!

This is a manufacturing case of internal collaboration between the circuit board business and the photomask business. In normal patterning, photomasks are used for patterning, but this time, we directly patterned on the substrate coated with photoresist using a drawing device that draws the photomask, exposing it to light for patterning. As a result, we were able to create fine patterns at the "L/S=5μm" level, which are impossible to achieve with normal patterning. [Case Overview] ■ L/S: Targeting 5μm → L=4.7μm/S=5.1μm ■ Film Specifications: From the base layer Cu 2μm/Ni 0.5μm/Au 1μm (Total thickness 3.5μm) *For more details, please refer to the PDF document or feel free to contact us.

    Other electronic partsCircuit board design and manufacturing
2020-12-08_11h27_22.png

[Circuit Board Manufacturing Case] Fine Patterning by Direct Drawing

2020-12-08_11h27_22.png
2020-12-08_11h27_22.png
  • Related Link - http://www.toyo-ppm.co.jp/works/720

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東洋精密工業

東洋精密工業

Electronic Components and Semiconductors

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Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.

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