Alumina and aluminum nitride, etc.! Circuit formation is possible on one to four surfaces of high thermal conductivity ceramic substrates.
This is an introduction to a manufacturing case that involves patterning processing on the sides of substrates to enable high-density implementation. It is possible to form circuits on one to four sides of high thermal conductivity ceramic substrates such as alumina and aluminum nitride. Please feel free to consult us when needed. 【Case Overview】 ■ Material: Alumina, Aluminum Nitride ■ Conductor Film: Ti/Pt/Au ■ Chip Size: 1.72mm × 1.1mm × 0.5mm *For more details, please refer to the PDF document or feel free to contact us.
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