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Electronic circuit board

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Thin film, thick film circuit board

last updated:Mar 25, 2009

東洋精密工業
東洋精密工業
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Thin film and thick film circuit substrates. Formation of conductors, dielectrics, resistors, and phosphor circuits.

For non-printed circuit boards, please leave it to Toyo Seimitsu Kogyo. We will propose the optimal board according to your specified requirements.

    Printed Circuit BoardCeramicsOrganic Natural Materials
WS000052.JPG

Electronic circuit board

WS000052.JPG
WS000052.JPG

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basic information

We use screen printing (thick film) and PVD (thin film) technology, along with lithography techniques, to form conductors, dielectrics, resistors, and phosphor circuits on substrates such as ceramics, glass, PET, PI, and metals. Our products are used in information communication devices like satellites and base stations, as well as in industrial equipment, sensors, consumer devices, and displays. You can trust us with ceramic substrates, glass substrates, and metal substrates. We provide precision circuit substrates with high reliability according to our customers' requirements.

Price information

We will provide an estimate based on the drawings and requirements specifications. The estimate is free of charge.

Delivery Time

Please contact us for details

※Approximately 1 to 6 weeks (varies depending on specifications)

Applications/Examples of results

Various sensors: temperature and humidity sensors, biosensors, accelerometers, pressure sensors, etc. Various displays: LCD, PDP, EL, etc. Mounting substrates: MIC, HIC, MCM, BGA, CSP, LED submount, etc. Optical communication: high dielectric constant substrates.

Company information

東洋精密工業

東洋精密工業

Electronic Components and Semiconductors

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Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.

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